Scientists used an easy technique for growing hBN films on the surface area of ubiquitous steels and other metal alloys to “armor” them and thus increase their abilities. Credit: Adam Malin/ORNL, U.S. Dept. of EnergyHexagonal boron nitride coverings on metal alloys boost toughness, lower friction, and protect versus extreme conditions, paving the way for enhancements in solar panels, semiconductors, and aerospace components.Researchers demonstrated that stainless steel and other metal alloys covered with hexagonal boron nitride, or hBN, show low-friction or non-stick qualities along with improved long-lasting defense versus harsh corrosion and high-temperature oxidation in air.Metal alloys– mixtures of two or more metals– are developed to be strong, long lasting, and resistant to rust or oxidation. By adding finishings, or “armor,” to make those materials even harder, researchers might boost existing items and enable the production of new, ingenious ones.Applications of Armored Metal AlloysFor example, armoring might enhance the capability of photovoltaic panels to perform heat and withstand ecological factors. In addition, it enables semiconductors to keep correct operating temperature, and aerospace turbine blades to defend against wear, reduce friction and endure hot conditions. Innovative Coating ProcessThe hBN coatings are produced from a mix of solid boron sources and molecular nitrogen by utilizing a procedure called air pressure chemical vapor deposition.” This synthesis strategy addresses scalability issues such as expense and procedure safety in applications where those aspects have been problematic,” stated ORNLs Ivan Vlassiouk, who led the study. “Besides supplying a versatile protective layer for steels and metals, utilizing this procedure to manufacture single- and few-layer hBN for emerging two-dimensional electronic and photonic gadgets might enhance their performance.” Reference: “Armor for Steel: Facile Synthesis of Hexagonal Boron Nitride Films on Various Substrates” by Ivan Vlassiouk, Sergei Smirnov, Alexander Puretzky, Olugbenga Olunloyo, David B. Geohegan, Ondrej Dyck, Andrew R. Lupini, Raymond R. Unocic, Harry M. Meyer, Kai Xiao, Dayrl Briggs, Nickolay Lavrik, Jong Keum, Ercan Cakmak, Sumner B. Harris, Marti Checa, Liam Collins, John Lasseter, Reece Emery, John Rayle, Philip D. Rack, Yijing Stehle, Pavan Chaturvedi, Piran R. Kidambi, Gong Gu and Ilia Ivanov, 20 October 2023, Advanced Materials Interfaces.DOI: 10.1002/ admi.202300704.
